Factory Lead Time  

12 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-SOIC (0.154, 3.90mm Width)

Number of Pins  

8

Transistor Element Material  

SILICON

Current - Continuous Drain (Id) @ 25℃  

21A Ta

Drive Voltage (Max Rds On, Min Rds On)  

4.5V 10V

Number of Elements  

1

Power Dissipation (Max)  

2.5W Ta

Turn Off Delay Time  

15 ns

Voltage - Gate Threshold (Vgs(th)) (Max) @ Id  

2.35V @ 50μA

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

HEXFET®

Published  

2009

JESD-609 Code  

e3

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

8

ECCN Code  

EAR99

Resistance  

3.5MOhm

Terminal Finish  

Matte Tin (Sn)

Terminal Position  

DUAL

Terminal Form  

GULL WING

Configuration  

SINGLE WITH BUILT-IN DIODE

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

2.5W

Turn On Delay Time  

13 ns

FET Type  

N-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

3.5m Ω @ 21A, 10V

Input Capacitance (Ciss) (Max) @ Vds  

3175pF @ 15V

Gate Charge (Qg) (Max) @ Vgs  

30nC @ 4.5V

Rise Time  

16ns

Vgs (Max)  

±20V

Fall Time (Typ)  

8 ns

Continuous Drain Current (ID)  

21A

Gate to Source Voltage (Vgs)  

20V

Drain to Source Breakdown Voltage  

30V

Height  

1.4986mm

Width  

3.9878mm

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free